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Sn62Pb36Ag2 (25-45)
- Category： Specialty Chemicals
Sn62Pb36Ag2 (25-45 μ m, corresponding to 3 # powder) is a low melting point silver containing lead solder powder, with the following core application scenarios:
SMT Conventional Printing Process
This particle size specification is suitable for the use of mainstream 3 # powder and can be formulated into solder paste for reflow soldering of ordinary PCB and SMD components. The printing speed can reach up to 150mm/s and is suitable for pad printing operations with a spacing of 0.5mm or more.
Welding of silver containing electrode components
The device with silver containing electrodes matched with alloy composition can effectively avoid the problem of silver electrode dissolution, ensure the long-term reliability of solder joints, and adapt to the assembly of electronic products with high requirements for solder joint strength.
Medium and low temperature welding scenarios
Its melting point is about 179 ℃, which is lower than conventional Sn63Pb37 solder. It can be adapted for soldering PCB boards or thermal sensitive components that are not resistant to high temperatures, reducing the risk of thermal damage to the devices.
General industrial electronic assembly
Widely used in the mass production of mid to low end products in the fields of consumer electronics, communication equipment, etc., it complies with ISO 9454 1223, J-STD-004 REM-1 related standards, can adapt to non wash processes, and does not require additional cleaning after welding.
SMT Conventional Printing Process
This particle size specification is suitable for the use of mainstream 3 # powder and can be formulated into solder paste for reflow soldering of ordinary PCB and SMD components. The printing speed can reach up to 150mm/s and is suitable for pad printing operations with a spacing of 0.5mm or more.
Welding of silver containing electrode components
The device with silver containing electrodes matched with alloy composition can effectively avoid the problem of silver electrode dissolution, ensure the long-term reliability of solder joints, and adapt to the assembly of electronic products with high requirements for solder joint strength.
Medium and low temperature welding scenarios
Its melting point is about 179 ℃, which is lower than conventional Sn63Pb37 solder. It can be adapted for soldering PCB boards or thermal sensitive components that are not resistant to high temperatures, reducing the risk of thermal damage to the devices.
General industrial electronic assembly
Widely used in the mass production of mid to low end products in the fields of consumer electronics, communication equipment, etc., it complies with ISO 9454 1223, J-STD-004 REM-1 related standards, can adapt to non wash processes, and does not require additional cleaning after welding.
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